the technology
PVD (Physical Vapor Deposition) is a coating under controlled vacuum or atmospheric conditions.
This method permits to coat any material in any shapes,achieving metallized effects extremely resistant and durable over the time
the machines : horizontal / vertical
new and refurbished
The main equipment parts are as follows:
• process chamber
• vacuum pumping group
• electrical power supply system and control of gas flow
• electrical power supply system, control and generation of plasma
• PC and software control to ensure repeatibility of the process
• safety and self-diagnosis system
The process chamber contains the Plasma sources (stainless steel bars, aluminum or titanium)
powered by radio-frequency, mid – frequency or direct current.
The chamber is internally lined with stainless steel protection shields.
It is equipped with portholes for visual checking of the process and it’s thoroughly tested with a
helium mass spectrometer to guarantee its perfect sealing and air tightness in time.
machines
All the plants have automatic process control, temperature detection, pressure and gas flow
regulation, aswell as different substrate supports, including patented rapid loading systems.
Supplied on request: cold/hot water feeding, cleaning plants and instruments for quality control, for
example, Kalo-Tester, Rockwell-Tester, microscope with image elaboration.
horizontal
KOLZER DGK36”
Volume
ø 1000 mm x 1300 mm
Available technologies:
Sputtering
Thermal Evaporation
Plasma PECVD
Magnetron Sputtering
from 1 to 4
Productivity
from 4 min cycle
KOLZER DGK63”
Volume
ø 1600 mm x 1750 mm
Available technologies
Sputtering
Thermal Evaporation
Plasma PECVD
Magnetron Sputtering
from 1 to 6
Productivity
from 5 min cycle
vertical
KOLZER
MK63”
Volume
ø 1600 mm x 1450 mm
Available technologie
Sputtering
Thermal Evaporation
Plasma PECVD
Magnetron Sputtering
from 1 to 6
Productivity
from 5 min cycle